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  53 features specifications ( measured in a system t a =25 ) 50 ? , ! rf input power : +17dbm storage temp: 125 ! + broadband double balance mixer - d parameter unit guaranteed typical absolute maximum ratings bowei integrated circuits co.,ltd. b wei o isolation(db) lo &rf vswri vs frequency conversion loss vs frequency conversion loss(db) frequency(mhz) vswr ( ) db loss(db) typical performance 1.if 2.rf 3.gnd 4.lo metal case is ground application notes : isolation vs frequency frequency(mhz) frequency(mhz) conversion loss vs lo power lo p ower ( symbol frequency range lo & rf if f mhz 500 3000 ?^ 500 3000 ?^ conversion loss c . l db iso lo rf - lo if - rf if - iso db 1db compression point input intercept 3 rd order point p - 1 ip3 dbm dbm mdb-10/mdb-10m dc 00 ?^ 10 dc 00 ?^ 10 7(500 1500mhz) ?^ 6(500 1500mhz) ?^ 8 . 50 ?^ 3 5( 0 000mhz) 6 . 50 ?^ 3 5( 0 000mhz) 35( 500 000mhz) ?^ 1 45( 500 1000mhz) ?^ 26(1000 2000mhz) ?^ 30( 1000 2000mhz) ?^ 25( 2000 3000mhz) ?^ 25( 500 1000mhz) ?^ 30( 500 1000mhz) ?^ 14( 1000 3000mhz) ?^ 18(1000 3000mhz) ?^ 20( 500 1000mhz) ?^ 24( 500 1000mhz) ?^ 25(1000 2500mhz) ?^ 30(1000 2500mhz) ?^ 20(2500 3000mhz) ?^ 25( 2500 3000mhz) ?^ 2 4 - 14 1 2 3 4 to-8c bottom view bottom view sg03 if l o 1 2 3 4 %? %? %? %? tel:+86-311-87091891 87091887 fax:+86-311-87091282 http://www.cn-bowei.com e-mail:cjian@cn-bowei.com dbm) 3. land pattern should be place as close to ground as possible for better rf grounding 1. lo drive level : +10dbm 4. mdb - 10 : to - 8c package mdb - 10m :sg03 package 2 . in p ut/out p ut pin should be connected to 50 ? microstrip. rf %? lo drive level : +10dbm %? %? loss , high port - to - port isolation low conversion %? ? 50 impedance high reliability %? hermetic to-8c and sg03 package available %? !?^ ! operating temperature range:-55 +85 ( typ) lo : mhz &rf frequency range 50 ?^ 0 3000 20(2000 3000mhz) ?^ 5. see assembly section for mounting information pin connection : mark mark


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